933330390215
vs
BSS63,215
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
PLASTIC PACKAGE-3
PLASTIC PACKAGE-3
Pin Count
3
3
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
Collector Current-Max (IC)
0.1 A
0.1 A
Collector-Emitter Voltage-Max
100 V
100 V
Configuration
SINGLE
SINGLE
DC Current Gain-Min (hFE)
30
30
JEDEC-95 Code
TO-236AB
TO-236AB
JESD-30 Code
R-PDSO-G3
R-PDSO-G3
JESD-609 Code
e3
e3
Moisture Sensitivity Level
1
1
Number of Elements
1
1
Number of Terminals
3
3
Operating Temperature-Max
150 °C
150 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Polarity/Channel Type
PNP
PNP
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
YES
Terminal Finish
TIN
TIN
Terminal Form
GULL WING
GULL WING
Terminal Position
DUAL
DUAL
Transistor Application
SWITCHING
SWITCHING
Transistor Element Material
SILICON
SILICON
Transition Frequency-Nom (fT)
85 MHz
85 MHz
Base Number Matches
2
2
Part Package Code
TO-236
Manufacturer Package Code
SOT23
HTS Code
8541.21.00.95
Peak Reflow Temperature (Cel)
260
Power Dissipation-Max (Abs)
0.225 W
Time@Peak Reflow Temperature-Max (s)
30
VCEsat-Max
0.25 V
Compare 933330390215 with alternatives
Compare BSS63,215 with alternatives