89HPES24T3G2ZFALI
vs
89HPES24N3A1ZCBX
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
RENESAS ELECTRONICS CORP
|
Package Description |
BGA, BGA324,18X18,40
|
BGA-420
|
Reach Compliance Code |
not_compliant
|
compliant
|
ECCN Code |
3A991.A.2
|
|
HTS Code |
8542.31.00.01
|
|
Address Bus Width |
|
|
Bus Compatibility |
PCI; SMBUS
|
PCI, SMBUS
|
Clock Frequency-Max |
125 MHz
|
125 MHz
|
External Data Bus Width |
|
|
JESD-30 Code |
S-PBGA-B324
|
S-PBGA-B420
|
Length |
19 mm
|
27 mm
|
Number of Terminals |
324
|
420
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
LBGA
|
Package Equivalence Code |
BGA324,18X18,40
|
BGA420,26X26,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY, LOW PROFILE
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
3.42 mm
|
1.7 mm
|
Supply Current-Max |
1600 mA
|
928 mA
|
Supply Voltage-Max |
1.1 V
|
1.1 V
|
Supply Voltage-Min |
0.9 V
|
0.9 V
|
Supply Voltage-Nom |
1 V
|
1 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
19 mm
|
27 mm
|
uPs/uCs/Peripheral ICs Type |
BUS CONTROLLER, PCI
|
BUS CONTROLLER, PCI
|
Base Number Matches |
1
|
2
|
Data Transfer Rate-Max |
|
312.5 MBps
|
|
|
|
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