89HPES24T3G2ZFALI vs 89HPES24T3G2ZBALG feature comparison

89HPES24T3G2ZFALI Integrated Device Technology Inc

Buy Now Datasheet

89HPES24T3G2ZBALG Integrated Device Technology Inc

Buy Now Datasheet
Rohs Code No Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Package Description BGA, BGA324,18X18,40 19 X 19 MM, 1 MM PITCH, GREEN, FCBGA-324
Reach Compliance Code not_compliant compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width
Bus Compatibility PCI; SMBUS PCI
Clock Frequency-Max 125 MHz 125 MHz
External Data Bus Width
JESD-30 Code S-PBGA-B324 S-PBGA-B324
Length 19 mm 19 mm
Number of Terminals 324 324
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA324,18X18,40 BGA324,18X18,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.42 mm 3.42 mm
Supply Current-Max 1600 mA
Supply Voltage-Max 1.1 V 1.1 V
Supply Voltage-Min 0.9 V 0.9 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 19 mm 19 mm
uPs/uCs/Peripheral ICs Type BUS CONTROLLER, PCI BUS CONTROLLER, PCI
Base Number Matches 1 2
Pbfree Code Yes
Part Package Code FCBGA
Pin Count 324
Manufacturer Package Code ALG324
Additional Feature ALSO REQUIRES 3.3V SUPPLY
JESD-609 Code e1
Moisture Sensitivity Level 4
Peak Reflow Temperature (Cel) 260
Terminal Finish TIN SILVER COPPER
Time@Peak Reflow Temperature-Max (s) 30

Compare 89HPES24T3G2ZFALI with alternatives

Compare 89HPES24T3G2ZBALG with alternatives