89HPES24T3G2ZFALI
vs
89HPES24T3G2ZBAL
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Package Description |
BGA, BGA324,18X18,40
|
19 X 19 MM, 1 MM PITCH, FCBGA-324
|
Reach Compliance Code |
not_compliant
|
not_compliant
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
|
|
Bus Compatibility |
PCI; SMBUS
|
PCI
|
Clock Frequency-Max |
125 MHz
|
125 MHz
|
External Data Bus Width |
|
|
JESD-30 Code |
S-PBGA-B324
|
S-PBGA-B324
|
Length |
19 mm
|
19 mm
|
Number of Terminals |
324
|
324
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA324,18X18,40
|
BGA324,18X18,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
3.42 mm
|
3.42 mm
|
Supply Current-Max |
1600 mA
|
|
Supply Voltage-Max |
1.1 V
|
1.1 V
|
Supply Voltage-Min |
0.9 V
|
0.9 V
|
Supply Voltage-Nom |
1 V
|
1 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
19 mm
|
19 mm
|
uPs/uCs/Peripheral ICs Type |
BUS CONTROLLER, PCI
|
BUS CONTROLLER, PCI
|
Base Number Matches |
1
|
4
|
Pbfree Code |
|
No
|
Part Package Code |
|
FCBGA
|
Pin Count |
|
324
|
Manufacturer Package Code |
|
AL324
|
Additional Feature |
|
ALSO REQUIRES 3.3V SUPPLY
|
JESD-609 Code |
|
e0
|
Moisture Sensitivity Level |
|
4
|
Peak Reflow Temperature (Cel) |
|
225
|
Terminal Finish |
|
TIN LEAD
|
Time@Peak Reflow Temperature-Max (s) |
|
20
|
|
|
|
Compare 89HPES24T3G2ZFALI with alternatives
Compare 89HPES24T3G2ZBAL with alternatives