88E3018-A2-NNC1I000
vs
VSC8552XKS-02
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
MARVELL SEMICONDUCTOR INC
|
MICROSEMI CORP
|
Package Description |
9 X 9 MM, ROHS COMPLIANT, QFN-64
|
BGA,
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
26 Weeks
|
|
JESD-30 Code |
S-XQCC-N64
|
S-PBGA-B256
|
JESD-609 Code |
e3
|
|
Length |
9 mm
|
17 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
64
|
256
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
BGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
GRID ARRAY
|
Seated Height-Max |
1 mm
|
1.8 mm
|
Supply Voltage-Nom |
2.5 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
|
Telecom IC Type |
ETHERNET TRANSCEIVER
|
ETHERNET TRANSCEIVER
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Finish |
MATTE TIN
|
|
Terminal Form |
NO LEAD
|
BALL
|
Terminal Pitch |
0.5 mm
|
1 mm
|
Terminal Position |
QUAD
|
BOTTOM
|
Width |
9 mm
|
17 mm
|
Base Number Matches |
1
|
2
|
Samacsys Manufacturer |
|
Microsemi Corporation
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare 88E3018-A2-NNC1I000 with alternatives
Compare VSC8552XKS-02 with alternatives