VSC8552XKS-02
vs
KS8721SL
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
BGA,
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Microsemi Corporation
|
|
| JESD-30 Code |
S-PBGA-B256
|
R-PDSO-G48
|
| Length |
17 mm
|
15.875 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
256
|
48
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
SSOP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
GRID ARRAY
|
SMALL OUTLINE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Seated Height-Max |
1.8 mm
|
2.794 mm
|
| Supply Voltage-Nom |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
ETHERNET TRANSCEIVER
|
ETHERNET TRANSCEIVER
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
1 mm
|
0.635 mm
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Width |
17 mm
|
7.493 mm
|
| Base Number Matches |
2
|
2
|
| Part Package Code |
|
SSOP
|
| Pin Count |
|
48
|
| Operating Temperature-Max |
|
70 °C
|
| Operating Temperature-Min |
|
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
COMMERCIAL
|
|
|
|
Compare VSC8552XKS-02 with alternatives
Compare KS8721SL with alternatives