8001301ZA
vs
LH0032ACG
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
FILM MICROELECTRONICS INC
NATIONAL SEMICONDUCTOR CORP
Part Package Code
BCY
Package Description
QIP, QUAD12,.4SQ
QIP, QUAD12,.4SQ
Pin Count
12
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Architecture
VOLTAGE-FEEDBACK
VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB)
0.05 µA
0.01 µA
Bias Current-Max (IIB) @25C
0.0001 µA
0.005 µA
Common-mode Reject Ratio-Nom
50 dB
60 dB
Frequency Compensation
NO
NO
Input Offset Voltage-Max
10000 µV
7000 µV
JESD-30 Code
O-MBCY-W12
O-MBCY-W12
JESD-609 Code
e0
e0
Low-Offset
NO
NO
Neg Supply Voltage Limit-Max
-18 V
Neg Supply Voltage-Nom (Vsup)
-15 V
-15 V
Number of Functions
1
1
Number of Terminals
12
12
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-25 °C
Package Body Material
METAL
METAL
Package Code
QIP
QIP
Package Equivalence Code
QUAD12,.4SQ
QUAD12,.4SQ
Package Shape
ROUND
ROUND
Package Style
CYLINDRICAL
CYLINDRICAL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
Slew Rate-Min
350 V/us
350 V/us
Slew Rate-Nom
500 V/us
500 V/us
Supply Current-Max
20 mA
22 mA
Supply Voltage Limit-Max
18 V
18 V
Supply Voltage-Nom (Vsup)
15 V
15 V
Surface Mount
NO
NO
Temperature Grade
MILITARY
OTHER
Terminal Finish
Tin/Lead (Sn/Pb) - hot dipped
TIN LEAD
Terminal Form
WIRE
WIRE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
BOTTOM
BOTTOM
Voltage Gain-Min
710
710
Wideband
YES
YES
Base Number Matches
6
2
Technology
BIPOLAR
Unity Gain BW-Nom
70000
Compare 8001301ZA with alternatives
Compare LH0032ACG with alternatives