79RV5000200BS272I
vs
UPD30500BS2-300
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
NEC ELECTRONICS CORP
|
Part Package Code |
BGA
|
BGA
|
Package Description |
BGA,
|
LBGA,
|
Pin Count |
272
|
272
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
64
|
64
|
Bit Size |
64
|
64
|
Boundary Scan |
YES
|
NO
|
Clock Frequency-Max |
100 MHz
|
100 MHz
|
External Data Bus Width |
64
|
64
|
Format |
FLOATING POINT
|
FLOATING POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-PBGA-B272
|
S-PBGA-B272
|
JESD-609 Code |
e0
|
e0
|
Low Power Mode |
YES
|
NO
|
Number of Terminals |
272
|
272
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
LBGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY, LOW PROFILE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Speed |
200 MHz
|
300 MHz
|
Supply Voltage-Max |
3.465 V
|
1.9 V
|
Supply Voltage-Min |
3.135 V
|
1.7 V
|
Supply Voltage-Nom |
3.3 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
MOS
|
Temperature Grade |
INDUSTRIAL
|
OTHER
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
BALL
|
BALL
|
Terminal Position |
BOTTOM
|
BOTTOM
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
1
|
1
|
Additional Feature |
|
ALSO REQUIRES 3.3V SUPPLY FOR I/O
|
Length |
|
29 mm
|
Seated Height-Max |
|
1.7 mm
|
Terminal Pitch |
|
1.27 mm
|
Width |
|
29 mm
|
|
|
|
Compare 79RV5000200BS272I with alternatives
Compare UPD30500BS2-300 with alternatives