UPD30500BS2-300
vs
SPC5200CVR466BR2
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NEC ELECTRONICS CORP
FREESCALE SEMICONDUCTOR INC
Part Package Code
BGA
BGA
Package Description
LBGA,
BGA, BGA272,20X20,50
Pin Count
272
272
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
3A991
HTS Code
8542.31.00.01
8542.31.00.01
Additional Feature
ALSO REQUIRES 3.3V SUPPLY FOR I/O
ALSO REQUIRES 3.3V SUPPLY
Address Bus Width
64
32
Bit Size
64
32
Boundary Scan
NO
YES
Clock Frequency-Max
100 MHz
35 MHz
External Data Bus Width
64
32
Format
FLOATING POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B272
S-PBGA-B272
JESD-609 Code
e0
e1
Length
29 mm
27 mm
Low Power Mode
NO
YES
Number of Terminals
272
272
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.7 mm
2.65 mm
Speed
300 MHz
466 MHz
Supply Voltage-Max
1.9 V
1.58 V
Supply Voltage-Min
1.7 V
1.42 V
Supply Voltage-Nom
1.8 V
1.5 V
Surface Mount
YES
YES
Technology
MOS
CMOS
Temperature Grade
OTHER
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
29 mm
27 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR
Base Number Matches
1
1
Moisture Sensitivity Level
3
Package Equivalence Code
BGA272,20X20,50
Peak Reflow Temperature (Cel)
260
Screening Level
AEC-Q100
Time@Peak Reflow Temperature-Max (s)
40
Compare UPD30500BS2-300 with alternatives
Compare SPC5200CVR466BR2 with alternatives