Part Details for UPD30500BS2-300 by NEC Electronics Group
Overview of UPD30500BS2-300 by NEC Electronics Group
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for UPD30500BS2-300
UPD30500BS2-300 CAD Models
UPD30500BS2-300 Part Data Attributes
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UPD30500BS2-300
NEC Electronics Group
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Datasheet
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UPD30500BS2-300
NEC Electronics Group
RISC Microprocessor, 64-Bit, 300MHz, MOS, PBGA272, 29 X 29 MM, PLASTIC, BGA-272
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NEC ELECTRONICS CORP | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 272 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Additional Feature | ALSO REQUIRES 3.3V SUPPLY FOR I/O | |
| Address Bus Width | 64 | |
| Bit Size | 64 | |
| Boundary Scan | NO | |
| Clock Frequency-Max | 100 MHz | |
| External Data Bus Width | 64 | |
| Format | FLOATING POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B272 | |
| JESD-609 Code | e0 | |
| Length | 29 mm | |
| Low Power Mode | NO | |
| Number of Terminals | 272 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.7 mm | |
| Speed | 300 MHz | |
| Supply Voltage-Max | 1.9 V | |
| Supply Voltage-Min | 1.7 V | |
| Supply Voltage-Nom | 1.8 V | |
| Surface Mount | YES | |
| Technology | MOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for UPD30500BS2-300
This table gives cross-reference parts and alternative options found for UPD30500BS2-300. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of UPD30500BS2-300, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| MPC5200CVR266B | 266MHz, MICROPROCESSOR, PBGA272, 27 X 27 MM, 1.27 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-272 | Freescale Semiconductor | UPD30500BS2-300 vs MPC5200CVR266B |
| IDT79RV5000267BS272 | RISC Microprocessor, 64-Bit, 267MHz, PBGA272, SBGA-272 | Integrated Device Technology Inc | UPD30500BS2-300 vs IDT79RV5000267BS272 |
| SPC5200VBV266BR2 | 266MHz, MICROPROCESSOR, PBGA272, 27 X 27 MM, 1.27 MM PITCH, HALIDE FREE, PLASTIC, BGA-272 | Freescale Semiconductor | UPD30500BS2-300 vs SPC5200VBV266BR2 |
| SPC5200VVR266B | 400MHz, MICROPROCESSOR, PBGA272, 27 X 27 MM, 1.27 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-272 | Freescale Semiconductor | UPD30500BS2-300 vs SPC5200VVR266B |
| 79RV5000250BS272 | RISC Microprocessor, 64-Bit, 250MHz, PBGA272, SBGA-272 | Integrated Device Technology Inc | UPD30500BS2-300 vs 79RV5000250BS272 |
| SC103335VR400B | 32-BIT, 400MHz, MICROPROCESSOR, PBGA272 | NXP Semiconductors | UPD30500BS2-300 vs SC103335VR400B |
| SPC5200CBV466B | 466MHz, MICROPROCESSOR, PBGA272, 27 X 27 MM, 1.27 MM PITCH, HALIDE FREE, PLASTIC, BGA-272 | Freescale Semiconductor | UPD30500BS2-300 vs SPC5200CBV466B |
| UPD30500BS2-250 | 64-BIT, 250MHz, RISC PROCESSOR, PBGA272, 29 X 29 MM, PLASTIC, BGA-272 | Renesas Electronics Corporation | UPD30500BS2-300 vs UPD30500BS2-250 |
| MPC5200CVR400BR2 | HABANERO INDUS - PBFREE | Freescale Semiconductor | UPD30500BS2-300 vs MPC5200CVR400BR2 |
| PPC5200CBV400 | RISC Microprocessor, 32-Bit, 400MHz, CMOS, PBGA272, 27 X 27 MM, 1.27 MM PITCH, THERMALLY ENHANCED, PLASTIC, BGA-272 | Motorola Semiconductor Products | UPD30500BS2-300 vs PPC5200CBV400 |