7901501EA
vs
HEF4052BDF
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
NXP SEMICONDUCTORS
Part Package Code
DIP
DIP
Package Description
DIP, DIP16,.3
DIP,
Pin Count
16
16
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Analog IC - Other Type
DIFFERENTIAL MULTIPLEXER
DIFFERENTIAL MULTIPLEXER
JESD-30 Code
R-GDIP-T16
R-GDIP-T16
Number of Channels
4
4
Number of Functions
1
1
Number of Terminals
16
16
On-state Resistance-Max (Ron)
3500 Ω
175 Ω
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
Supply Voltage-Max (Vsup)
15 V
15 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
15 V
Surface Mount
NO
NO
Switch-off Time-Max
420 ns
180 ns
Switch-on Time-Max
1200 ns
85 ns
Switching
BREAK-BEFORE-MAKE
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
Neg Supply Voltage-Nom (Vsup)
Off-state Isolation-Nom
50 dB
On-state Resistance Match-Nom
5 Ω
Seated Height-Max
5.08 mm
Width
7.62 mm
Compare 7901501EA with alternatives
Compare HEF4052BDF with alternatives