HEF4052BDF
vs
HEF4052BP,652
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
DIP
DIP
Package Description
DIP,
PLASTIC, DIP-16
Pin Count
16
16
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Analog IC - Other Type
DIFFERENTIAL MULTIPLEXER
DIFFERENTIAL MULTIPLEXER
JESD-30 Code
R-GDIP-T16
R-PDIP-T16
Neg Supply Voltage-Nom (Vsup)
Number of Channels
4
4
Number of Functions
1
1
Number of Terminals
16
16
Off-state Isolation-Nom
50 dB
50 dB
On-state Resistance Match-Nom
5 Ω
5 Ω
On-state Resistance-Max (Ron)
175 Ω
175 Ω
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
4.7 mm
Supply Voltage-Max (Vsup)
15 V
15 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
15 V
15 V
Surface Mount
NO
NO
Switch-off Time-Max
180 ns
180 ns
Switch-on Time-Max
85 ns
85 ns
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
1
1
Rohs Code
Manufacturer Package Code
SOT38-4
ECCN Code
EAR99
Factory Lead Time
4 Weeks
Samacsys Manufacturer
NXP
JESD-609 Code
e4
Length
21.6 mm
Package Equivalence Code
DIP16,.3
Supply Current-Max (Isup)
0.6 mA
Switching
BREAK-BEFORE-MAKE
Terminal Finish
NICKEL PALLADIUM GOLD
Compare HEF4052BDF with alternatives
Compare HEF4052BP,652 with alternatives