74LVT32374EC/G,518 vs 74LVT32374EC feature comparison

74LVT32374EC/G,518 NXP Semiconductors

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74LVT32374EC Philips Semiconductors

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Rohs Code Yes No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS PHILIPS SEMICONDUCTORS
Part Package Code BGA
Package Description LFBGA,
Pin Count 96
Manufacturer Package Code SOT536-1
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family LVT
JESD-30 Code R-PBGA-B96 R-PBGA-B96
Length 13.5 mm
Logic IC Type BUS DRIVER D FLIP-FLOP
Moisture Sensitivity Level 2
Number of Bits 8
Number of Functions 4 32
Number of Ports 2
Number of Terminals 96 96
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA FBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, FINE PITCH
Propagation Delay (tpd) 6.2 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.5 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology BICMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 5.5 mm
Base Number Matches 1 2
JESD-609 Code e0
Load Capacitance (CL) 50 pF
Max Frequency@Nom-Sup 150000000 Hz
Max I(ol) 0.064 A
Package Equivalence Code BGA96,6X16,32
Prop. Delay@Nom-Sup 5.3 ns
Terminal Finish Tin/Lead (Sn63Pb37)
Trigger Type POSITIVE EDGE

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