74LVC3G34DC,125 vs SN74LVC3G34DCURG4 feature comparison

74LVC3G34DC,125 NXP Semiconductors

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SN74LVC3G34DCURG4 Texas Instruments

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS TEXAS INSTRUMENTS INC
Part Package Code SSOP SOIC
Package Description 2.30 MM, PLASTIC, MO-187, SOT765-1, VSSOP-8 VSSOP, TSSOP8,.12,20
Pin Count 8 8
Manufacturer Package Code SOT765-1
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G8 R-PDSO-G8
JESD-609 Code e4 e4
Length 2.3 mm 2.3 mm
Logic IC Type BUFFER BUFFER
Moisture Sensitivity Level 1 1
Number of Functions 3 3
Number of Inputs 1 1
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VSSOP VSSOP
Package Equivalence Code TSSOP8,.12,20 TSSOP8,.12,20
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
Packing Method TR TR
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 10.8 ns 7.9 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 1 mm 0.9 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.65 V 1.65 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 2 mm 2 mm
Base Number Matches 1 1
Pbfree Code Yes
ECCN Code EAR99
Samacsys Manufacturer Texas Instruments
Load Capacitance (CL) 50 pF
Max I(ol) 0.032 A
Power Supply Current-Max (ICC) 0.01 mA
Prop. Delay@Nom-Sup 4.1 ns

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