74LVC3G34DC,125
vs
NC7NZ34K8X_NL
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
FAIRCHILD SEMICONDUCTOR CORP
Part Package Code
SSOP
TSSOP
Package Description
2.30 MM, PLASTIC, MO-187, SOT765-1, VSSOP-8
VSSOP, TSSOP8,.12,20
Pin Count
8
8
Manufacturer Package Code
SOT765-1
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-PDSO-G8
R-PDSO-G8
JESD-609 Code
e4
e3
Length
2.3 mm
2.3 mm
Logic IC Type
BUFFER
BUFFER
Moisture Sensitivity Level
1
1
Number of Functions
3
3
Number of Inputs
1
1
Number of Terminals
8
8
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VSSOP
VSSOP
Package Equivalence Code
TSSOP8,.12,20
TSSOP8,.12,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
Packing Method
TR
TR
Peak Reflow Temperature (Cel)
260
Propagation Delay (tpd)
10.8 ns
8.8 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
NO
Seated Height-Max
1 mm
0.9 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1.65 V
1.65 V
Supply Voltage-Nom (Vsup)
3.3 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
2 mm
2 mm
Base Number Matches
2
1
ECCN Code
EAR99
Load Capacitance (CL)
50 pF
Max I(ol)
0.024 A
Prop. Delay@Nom-Sup
5.1 ns
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