SN74LVC3G34DCURG4
vs
SN74LVC3G17DCUR
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
TEXAS INSTRUMENTS INC
ROCHESTER ELECTRONICS INC
Part Package Code
SOIC
SOIC
Package Description
VSSOP, TSSOP8,.12,20
VSSOP,
Pin Count
8
8
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8542.39.00.01
Samacsys Manufacturer
Texas Instruments
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-PDSO-G8
R-PDSO-G8
JESD-609 Code
e4
e1
Length
2.3 mm
2.3 mm
Load Capacitance (CL)
50 pF
Logic IC Type
BUFFER
BUFFER
Max I(ol)
0.032 A
Moisture Sensitivity Level
1
1
Number of Functions
3
3
Number of Inputs
1
1
Number of Terminals
8
8
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VSSOP
VSSOP
Package Equivalence Code
TSSOP8,.12,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
Packing Method
TR
Peak Reflow Temperature (Cel)
260
260
Power Supply Current-Max (ICC)
0.01 mA
Prop. Delay@Nom-Sup
4.1 ns
Propagation Delay (tpd)
7.9 ns
9.2 ns
Qualification Status
Not Qualified
Schmitt Trigger
NO
Seated Height-Max
0.9 mm
0.9 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1.65 V
1.65 V
Supply Voltage-Nom (Vsup)
3.3 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
TIN SILVER COPPER
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
NOT SPECIFIED
Width
2 mm
2 mm
Base Number Matches
1
2
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