SN74LVCHR32245AKR vs 74LVC32245AEC,551 feature comparison

SN74LVCHR32245AKR Texas Instruments

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74LVC32245AEC,551 NXP Semiconductors

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Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer TEXAS INSTRUMENTS INC NXP SEMICONDUCTORS
Part Package Code BGA BGA
Package Description LFBGA-96 13.50 X 5.50 MM, 1.05 MM HEIGHT, PLASTIC, SOT536-1, LFBGA-96
Pin Count 96 96
Reach Compliance Code not_compliant compliant
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Control Type COMMON CONTROL
Count Direction BIDIRECTIONAL
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PBGA-B96 R-PBGA-B96
JESD-609 Code e0
Length 13.5 mm 13.5 mm
Logic IC Type BUS TRANSCEIVER BUS TRANSCEIVER
Max I(ol) 0.012 A
Moisture Sensitivity Level 2 4
Number of Bits 8 8
Number of Functions 4 4
Number of Ports 2 2
Number of Terminals 96 96
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE WITH SERIES RESISTOR 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA96,6X16,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Packing Method TR
Peak Reflow Temperature (Cel) 235
Power Supply Current-Max (ICC) 0.04 mA
Prop. Delay@Nom-Sup 4.8 ns
Propagation Delay (tpd) 12.5 ns 4.7 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.5 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 1.65 V 1.2 V
Supply Voltage-Nom (Vsup) 1.8 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Width 5.5 mm 5.5 mm
Base Number Matches 1 2
Manufacturer Package Code SOT536-1
Factory Lead Time 4 Weeks

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Compare 74LVC32245AEC,551 with alternatives