74LVC2G86GM vs 74HCT2G00DC,125 feature comparison

74LVC2G86GM NXP Semiconductors

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74HCT2G00DC,125 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code QFN SSOP
Package Description 1.60 X 1.60 MM, 0.50 MM HEIGHT, 0.50 MM PITCH, PLASTIC, MO-255, SOT902-1, QFN-8 2.30 MM, PLASTIC, MO-187, SOT765-1, VSSOP-8
Pin Count 8 8
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z HCT
JESD-30 Code S-PQCC-N8 R-PDSO-G8
Length 1.6 mm 2.3 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type XOR GATE NAND GATE
Max I(ol) 0.024 A 0.004 A
Moisture Sensitivity Level 1 1
Number of Functions 2 2
Number of Inputs 2 2
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVQCCN VSSOP
Package Equivalence Code LCC8,.06SQ,20 TSSOP8,.12,20
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
Packing Method TR TR
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 5.9 ns 29 ns
Propagation Delay (tpd) 12.4 ns 29 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 0.5 mm 1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.65 V 4.5 V
Supply Voltage-Nom (Vsup) 3.3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 1.6 mm 2 mm
Base Number Matches 3 2
Manufacturer Package Code SOT765-1
Factory Lead Time 4 Weeks
JESD-609 Code e4
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)

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