74LVC2G86GM
vs
74AHCT2G00DC,125
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
NEXPERIA
Part Package Code
QFN
SSOP
Package Description
1.60 X 1.60 MM, 0.50 MM HEIGHT, 0.50 MM PITCH, PLASTIC, MO-255, SOT902-1, QFN-8
2.30 MM, PLASTIC, MO-187, SOT765-1, VSSOP-8
Pin Count
8
8
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
LVC/LCX/Z
AHCT/VHCT/VT
JESD-30 Code
S-PQCC-N8
R-PDSO-G8
Length
1.6 mm
2.3 mm
Load Capacitance (CL)
50 pF
Logic IC Type
XOR GATE
NAND GATE
Max I(ol)
0.024 A
Moisture Sensitivity Level
1
1
Number of Functions
2
2
Number of Inputs
2
2
Number of Terminals
8
8
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVQCCN
VSSOP
Package Equivalence Code
LCC8,.06SQ,20
TSSOP8,.12,20
Package Shape
SQUARE
RECTANGULAR
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
Packing Method
TR
TR, 7 INCH
Peak Reflow Temperature (Cel)
260
260
Prop. Delay@Nom-Sup
5.9 ns
Propagation Delay (tpd)
12.4 ns
10 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
Seated Height-Max
0.5 mm
1 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1.65 V
4.5 V
Supply Voltage-Nom (Vsup)
3.3 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Width
1.6 mm
2 mm
Base Number Matches
3
2
Manufacturer Package Code
SOT765-1
Factory Lead Time
8 Weeks
Samacsys Manufacturer
Nexperia
JESD-609 Code
e4
Terminal Finish
NICKEL PALLADIUM GOLD
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