Findchips: Compare 74LVC2G17GM,115 vs 74LVC2G17GM

74LVC2G17GM,115 vs 74LVC2G17GM feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	Yes	Yes
Part Life Cycle Code	Transferred	Active
Ihs Manufacturer	NXP SEMICONDUCTORS	NEXPERIA
Part Package Code	SON
Package Description	1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, SON-6	XSON-6
Pin Count	6
Manufacturer Package Code	SOT886
Reach Compliance Code	compliant	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Family	LVC/LCX/Z	LVC/LCX/Z
JESD-30 Code	R-PDSO-N6	R-PDSO-N6
JESD-609 Code	e3	e4
Length	1.45 mm	1.45 mm
Logic IC Type	BUFFER	BUFFER
Moisture Sensitivity Level	1	1
Number of Functions	2	2
Number of Inputs	1	1
Number of Terminals	6	6
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-40 °C	-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	VSON	VSON
Package Equivalence Code	SOLCC6,.04,20	SOLCC6,.04,20
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE, VERY THIN PROFILE	SMALL OUTLINE, VERY THIN PROFILE
Packing Method	TR
Peak Reflow Temperature (Cel)	260	260
Propagation Delay (tpd)	13.1 ns	13.1 ns
Qualification Status	Not Qualified
Schmitt Trigger	YES	YES
Seated Height-Max	0.5 mm	0.5 mm
Supply Voltage-Max (Vsup)	5.5 V	5.5 V
Supply Voltage-Min (Vsup)	1.65 V	1.65 V
Supply Voltage-Nom (Vsup)	3.3 V	3.3 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	AUTOMOTIVE	AUTOMOTIVE
Terminal Finish	Tin (Sn)	NICKEL PALLADIUM GOLD
Terminal Form	NO LEAD	NO LEAD
Terminal Pitch	0.5 mm	0.5 mm
Terminal Position	DUAL	DUAL
Time@Peak Reflow Temperature-Max (s)	30	30
Width	1 mm	1 mm
Base Number Matches	2	3
Date Of Intro		2017-02-18
Power Supply Current-Max (ICC)		0.004 mA
	Logic » Gates	Logic » Gates