Findchips: Compare 74LVC2G17GM,115 vs 74LVC1G00GF,132

74LVC2G17GM,115 vs 74LVC1G00GF,132 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	Yes	Yes
Part Life Cycle Code	Transferred	Transferred
Ihs Manufacturer	NXP SEMICONDUCTORS	NXP SEMICONDUCTORS
Part Package Code	SON	SON
Package Description	1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, SON-6	1 X 1 MM, 0.50 MM HEIGHT, PLASTIC, SOT-891, SON-6
Pin Count	6	6
Manufacturer Package Code	SOT886	SOT891
Reach Compliance Code	compliant	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Family	LVC/LCX/Z	LVC/LCX/Z
JESD-30 Code	R-PDSO-N6	S-PDSO-N6
JESD-609 Code	e3	e3
Length	1.45 mm	1 mm
Logic IC Type	BUFFER	NAND GATE
Moisture Sensitivity Level	1	1
Number of Functions	2	1
Number of Inputs	1	2
Number of Terminals	6	6
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-40 °C	-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	VSON	VSON
Package Equivalence Code	SOLCC6,.04,20	SOLCC6,.04,14
Package Shape	RECTANGULAR	SQUARE
Package Style	SMALL OUTLINE, VERY THIN PROFILE	SMALL OUTLINE, VERY THIN PROFILE
Packing Method	TR	TR
Peak Reflow Temperature (Cel)	260	260
Propagation Delay (tpd)	13.1 ns	10.5 ns
Qualification Status	Not Qualified	Not Qualified
Schmitt Trigger	YES	NO
Seated Height-Max	0.5 mm	0.5 mm
Supply Voltage-Max (Vsup)	5.5 V	5.5 V
Supply Voltage-Min (Vsup)	1.65 V	1.65 V
Supply Voltage-Nom (Vsup)	3.3 V	3.3 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	AUTOMOTIVE	AUTOMOTIVE
Terminal Finish	Tin (Sn)	Tin (Sn)
Terminal Form	NO LEAD	NO LEAD
Terminal Pitch	0.5 mm	0.35 mm
Terminal Position	DUAL	DUAL
Time@Peak Reflow Temperature-Max (s)	30	30
Width	1 mm	1 mm
Base Number Matches	2	2
Factory Lead Time		4 Weeks
	Logic » Gates	Logic » Gates