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74LVC2G17GM vs 74LVC1G00GF,132 feature comparison

74LVC2G17GM Philips Semiconductors

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74LVC1G00GF,132 NXP Semiconductors

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Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer PHILIPS SEMICONDUCTORS NXP SEMICONDUCTORS
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDSO-N6 S-PDSO-N6
JESD-609 Code e0 e3
Load Capacitance (CL) 50 pF
Logic IC Type BUFFER NAND GATE
Max I(ol) 0.024 A
Number of Terminals 6 6
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SON VSON
Package Equivalence Code SOLCC6,.04,20 SOLCC6,.04,14
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE SMALL OUTLINE, VERY THIN PROFILE
Packing Method TR TR
Prop. Delay@Nom-Sup 7.1 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES NO
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Tin/Lead (Sn/Pb) Tin (Sn)
Terminal Form NO LEAD NO LEAD
Terminal Pitch 0.5 mm 0.35 mm
Terminal Position DUAL DUAL
Base Number Matches 3 2
Part Package Code SON
Package Description 1 X 1 MM, 0.50 MM HEIGHT, PLASTIC, SOT-891, SON-6
Pin Count 6
Manufacturer Package Code SOT891
Factory Lead Time 4 Weeks
Family LVC/LCX/Z
Length 1 mm
Moisture Sensitivity Level 1
Number of Functions 1
Number of Inputs 2
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 10.5 ns
Seated Height-Max 0.5 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 1.65 V
Time@Peak Reflow Temperature-Max (s) 30
Width 1 mm
Logic » Gates
Logic » Gates

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