74LV02D,118 vs N74LV02DB feature comparison

74LV02D,118 NXP Semiconductors

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N74LV02DB NXP Semiconductors

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Rohs Code Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code SOIC
Package Description 3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14 SSOP,
Pin Count 14
Manufacturer Package Code SOT108-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Family LV/LV-A/LVX/H LV/LV-A/LVX/H
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e4
Length 8.65 mm 6.2 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NOR GATE NOR GATE
Max I(ol) 0.006 A
Moisture Sensitivity Level 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SSOP
Package Equivalence Code SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, SHRINK PITCH
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 15 ns
Propagation Delay (tpd) 26 ns 15 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO
Seated Height-Max 1.75 mm 2 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1 V 1 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9 mm 5.3 mm
Base Number Matches 1 2

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Compare N74LV02DB with alternatives