Findchips: Compare 74LV00DB,118 vs HD74LV00ARP

74LV00DB,118 vs HD74LV00ARP feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	Yes
Part Life Cycle Code	Transferred	Obsolete
Ihs Manufacturer	NXP SEMICONDUCTORS	RENESAS TECHNOLOGY CORP
Part Package Code	SSOP1	SOIC
Package Description	5.30 MM, PLASTIC, MO-150, SOT337-1, SSOP-14	SOP,
Pin Count	14	14
Manufacturer Package Code	SOT337-1
Reach Compliance Code	compliant	unknown
HTS Code	8542.39.00.01	8542.39.00.01
Factory Lead Time	4 Weeks
Family	LV/LV-A/LVX/H	LV/LV-A/LVX/H
JESD-30 Code	R-PDSO-G14	R-PDSO-G14
JESD-609 Code	e4
Length	6.2 mm	8.65 mm
Load Capacitance (CL)	50 pF
Logic IC Type	NAND GATE	NAND GATE
Max I(ol)	0.006 A
Moisture Sensitivity Level	1
Number of Functions	4	4
Number of Inputs	2	2
Number of Terminals	14	14
Operating Temperature-Max	125 °C	85 °C
Operating Temperature-Min	-40 °C	-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	SSOP	SOP
Package Equivalence Code	SSOP14,.3
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE
Packing Method	TR
Peak Reflow Temperature (Cel)	260
Prop. Delay@Nom-Sup	18 ns
Propagation Delay (tpd)	31 ns	20 ns
Qualification Status	Not Qualified	Not Qualified
Schmitt Trigger	NO
Seated Height-Max	2 mm	1.75 mm
Supply Voltage-Max (Vsup)	5.5 V	5.5 V
Supply Voltage-Min (Vsup)	1 V	2 V
Supply Voltage-Nom (Vsup)	3.3 V	2.5 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	AUTOMOTIVE	INDUSTRIAL
Terminal Finish	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form	GULL WING	GULL WING
Terminal Pitch	0.65 mm	1.27 mm
Terminal Position	DUAL	DUAL
Time@Peak Reflow Temperature-Max (s)	30
Width	5.3 mm	3.95 mm
Base Number Matches	2	2
	Logic » Gates	Logic » Gates