74LV00DB,118 vs 74LV00DB feature comparison

74LV00DB,118 NXP Semiconductors

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74LV00DB Nexperia

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Not Recommended
Ihs Manufacturer NXP SEMICONDUCTORS NEXPERIA
Part Package Code SSOP1
Package Description 5.30 MM, PLASTIC, MO-150, SOT337-1, SSOP-14 SSOP,
Pin Count 14
Manufacturer Package Code SOT337-1
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Family LV/LV-A/LVX/H LV/LV-A/LVX/H
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e4 e4
Length 6.2 mm 6.2 mm
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.006 A
Moisture Sensitivity Level 1 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP SSOP
Package Equivalence Code SSOP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH
Packing Method TR
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 18 ns
Propagation Delay (tpd) 31 ns 31 ns
Qualification Status Not Qualified
Schmitt Trigger NO
Seated Height-Max 2 mm 2 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1 V 1 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) NICKEL PALLADIUM GOLD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 5.3 mm 5.3 mm
Base Number Matches 2 3
Date Of Intro 2017-02-01

Compare 74LV00DB,118 with alternatives

Compare 74LV00DB with alternatives