74LCX74BQX
vs
74LCX74M
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
FAIRCHILD SEMICONDUCTOR CORP
NATIONAL SEMICONDUCTOR CORP
Part Package Code
MLP
Package Description
2.50 X 3 MM, LEAD FREE, MO-241AA, DQFN-14
SOP, SOP14,.25
Pin Count
14
Manufacturer Package Code
14LD,DQFN,JEDEC MO-241,2.5 X 3.0MM
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-XQCC-N14
R-PDSO-G14
JESD-609 Code
e4
e0
Length
3 mm
8.65 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Max I(ol)
0.024 A
0.024 A
Moisture Sensitivity Level
1
Number of Bits
1
1
Number of Functions
2
2
Number of Terminals
14
14
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
HVQCCN
SOP
Package Equivalence Code
LCC14,.1X.12,20
SOP14,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
SMALL OUTLINE
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
7 ns
7 ns
Propagation Delay (tpd)
8.4 ns
7 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
0.8 mm
1.75 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
NICKEL PALLADIUM GOLD
Tin/Lead (Sn/Pb)
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
0.5 mm
1.27 mm
Terminal Position
QUAD
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
2.5 mm
3.9 mm
fmax-Min
150 MHz
150 MHz
Base Number Matches
2
5
Max Frequency@Nom-Sup
150000000 Hz
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