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74HCT3G34DC vs 74AUP3G04GM,125 feature comparison

74HCT3G34DC NXP Semiconductors

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74AUP3G04GM,125 NXP Semiconductors

Buy Now Datasheet
Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code TSSOP QFN
Package Description VSSOP, 1.60 X 1.60 MM, 0.50 MM HEIGHT, PLASTIC, MO-255, SOT902-1, QFN-8
Pin Count 8 8
Reach Compliance Code compliant compliant
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Family HCT AUP/ULP/V
JESD-30 Code R-PDSO-G8 S-PQCC-N8
JESD-609 Code e4 e4
Length 2.3 mm 1.6 mm
Logic IC Type BUFFER INVERTER
Moisture Sensitivity Level 1 1
Number of Functions 3 3
Number of Inputs 1 1
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VSSOP VQCCN
Package Equivalence Code TSSOP8,.12,20 LCC8,.06SQ,20
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH CHIP CARRIER, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 29 ns 20.9 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm 0.5 mm
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 4.5 V 0.8 V
Supply Voltage-Nom (Vsup) 5 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING NO LEAD
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Width 2 mm 1.6 mm
Base Number Matches 3 2
Manufacturer Package Code SOT902-2
Load Capacitance (CL) 30 pF
Max I(ol) 0.0017 A
Packing Method TR
Prop. Delay@Nom-Sup 20.9 ns
Schmitt Trigger NO
Logic » Gates
Logic » Gates

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