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74AUP3G04GM,125 vs 74HC2G02DC feature comparison

74AUP3G04GM,125 NXP Semiconductors

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74HC2G02DC Philips Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS PHILIPS SEMICONDUCTORS
Part Package Code QFN
Package Description 1.60 X 1.60 MM, 0.50 MM HEIGHT, PLASTIC, MO-255, SOT902-1, QFN-8 TSSOP, TSSOP8,.12,20
Pin Count 8
Manufacturer Package Code SOT902-2
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family AUP/ULP/V
JESD-30 Code S-PQCC-N8 R-PDSO-G8
JESD-609 Code e4
Length 1.6 mm
Load Capacitance (CL) 30 pF 50 pF
Logic IC Type INVERTER NOR GATE
Max I(ol) 0.0017 A 0.004 A
Moisture Sensitivity Level 1
Number of Functions 3
Number of Inputs 1
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VQCCN TSSOP
Package Equivalence Code LCC8,.06SQ,20 TSSOP8,.12,20
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR TR
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 20.9 ns 22 ns
Propagation Delay (tpd) 20.9 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 0.5 mm
Supply Voltage-Max (Vsup) 3.6 V 6 V
Supply Voltage-Min (Vsup) 0.8 V 2 V
Supply Voltage-Nom (Vsup) 1.2 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 1.6 mm
Base Number Matches 2 3
Logic » Gates
Logic » Gates

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