74HCT00BQ,115
vs
CD4010BHMSR
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
HARRIS SEMICONDUCTOR
Part Package Code
QFN
Package Description
2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT-762-1, DHVQFN-14
DIE,
Pin Count
14
Manufacturer Package Code
SOT762-1
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
4 Weeks
Family
HCT
4000/14000/40000
JESD-30 Code
R-PQCC-N14
X-XUUC-N14
JESD-609 Code
e4
Length
3 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
NAND GATE
BUFFER
Max I(ol)
0.004 A
Moisture Sensitivity Level
1
Number of Functions
4
6
Number of Inputs
2
1
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
HVQCCN
DIE
Package Equivalence Code
LCC14,.1X.12,20
DIE OR CHIP
Package Shape
RECTANGULAR
UNSPECIFIED
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
UNCASED CHIP
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
29 ns
Propagation Delay (tpd)
29 ns
175.5 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
Seated Height-Max
1 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
MILITARY
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.5 mm
Terminal Position
QUAD
UPPER
Time@Peak Reflow Temperature-Max (s)
30
Width
2.5 mm
Base Number Matches
2
2
Additional Feature
DUAL SUPPLY HIGH TO LOW VOLTAGE TRANSLATOR
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