Findchips: Compare CD4010BHMSR vs 74AHC132BQ,115

CD4010BHMSR vs 74AHC132BQ,115 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Obsolete	Transferred
Ihs Manufacturer	HARRIS SEMICONDUCTOR	NXP SEMICONDUCTORS
Package Description	DIE,	HVQCCN, LCC14,.1X.12,20
Reach Compliance Code	unknown	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Additional Feature	DUAL SUPPLY HIGH TO LOW VOLTAGE TRANSLATOR
Family	4000/14000/40000	AHC/VHC/H/U/V
JESD-30 Code	X-XUUC-N14	R-PQCC-N14
Load Capacitance (CL)	50 pF	50 pF
Logic IC Type	BUFFER	NAND GATE
Number of Functions	6	4
Number of Inputs	1	2
Number of Terminals	14	14
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-55 °C	-40 °C
Package Body Material	UNSPECIFIED	PLASTIC/EPOXY
Package Code	DIE	HVQCCN
Package Equivalence Code	DIE OR CHIP	LCC14,.1X.12,20
Package Shape	UNSPECIFIED	RECTANGULAR
Package Style	UNCASED CHIP	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Propagation Delay (tpd)	175.5 ns	19.5 ns
Qualification Status	Not Qualified	Not Qualified
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	MILITARY	AUTOMOTIVE
Terminal Form	NO LEAD	NO LEAD
Terminal Position	UPPER	QUAD
Base Number Matches	2	2
Rohs Code		Yes
Part Package Code		QFN
Pin Count		14
Manufacturer Package Code		SOT762-1
JESD-609 Code		e4
Length		3 mm
Max I(ol)		0.008 A
Moisture Sensitivity Level		1
Packing Method		TR
Peak Reflow Temperature (Cel)		260
Prop. Delay@Nom-Sup		12.5 ns
Schmitt Trigger		YES
Seated Height-Max		1 mm
Supply Voltage-Max (Vsup)		5.5 V
Supply Voltage-Min (Vsup)		2 V
Supply Voltage-Nom (Vsup)		5 V
Terminal Finish		Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Pitch		0.5 mm
Time@Peak Reflow Temperature-Max (s)		30
Width		2.5 mm
	Logic » Gates	Logic » Gates