74HC4514N
vs
74HC154D
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
DIP
SOIC
Package Description
DIP, DIP24,.6
7.50 MM, PLASTIC, MS-013, SOT137-1, SOP-24
Pin Count
24
24
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
ADDRESS LATCHES
2 ENABLE INPUTS
Family
HC/UH
HC/UH
Input Conditioning
LATCHED
STANDARD
JESD-30 Code
R-PDIP-T24
R-PDSO-G24
JESD-609 Code
e3
e4
Length
31.7 mm
15.4 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
OTHER DECODER/DRIVER
OTHER DECODER/DRIVER
Max I(ol)
0.004 A
0.004 A
Number of Functions
1
1
Number of Terminals
24
24
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
TRUE
INVERTED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Equivalence Code
DIP24,.6
SOP24,.4
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Prop. Delay@Nom-Sup
69 ns
45 ns
Propagation Delay (tpd)
69 ns
225 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.1 mm
2.65 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
TIN
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
7.5 mm
Base Number Matches
4
8
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
30
Compare 74HC4514N with alternatives
Compare 74HC154D with alternatives