74HC3G34DP vs NLU3G16AMX1TCG feature comparison

74HC3G34DP Philips Semiconductors

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NLU3G16AMX1TCG onsemi

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Rohs Code No
Part Life Cycle Code Transferred End Of Life
Ihs Manufacturer PHILIPS SEMICONDUCTORS ONSEMI
Package Description TSSOP, TSSOP8,.16 ULLGA-8
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDSO-G8 R-PDSO-N8
JESD-609 Code e0 e4
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type BUFFER BUFFER
Max I(ol) 0.004 A 0.004 A
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP VSON
Package Equivalence Code TSSOP8,.16 SOLCC6,.04,20
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, VERY THIN PROFILE
Packing Method TR TR
Prop. Delay@Nom-Sup 25 ns 14.5 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 1.65 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish Tin/Lead (Sn/Pb) NICKEL PALLADIUM GOLD
Terminal Form GULL WING NO LEAD
Terminal Pitch 0.635 mm 0.5 mm
Terminal Position DUAL DUAL
Base Number Matches 3 1
Pbfree Code Yes
Part Package Code ULLGA8 1.95x1.0, 0.5P
Pin Count 8
Manufacturer Package Code 613AC
Factory Lead Time 2 Days
Samacsys Manufacturer onsemi
Family 3G
Length 1.95 mm
Moisture Sensitivity Level 1
Number of Functions 3
Number of Inputs 1
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 14.5 ns
Seated Height-Max 0.4 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 1 mm

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