NLU3G16AMX1TCG
vs
74HCT3G07DP
feature comparison
Pbfree Code |
Yes
|
|
Part Life Cycle Code |
End Of Life
|
Transferred
|
Ihs Manufacturer |
ONSEMI
|
PHILIPS SEMICONDUCTORS
|
Part Package Code |
ULLGA8 1.95x1.0, 0.5P
|
|
Package Description |
ULLGA-8
|
TSSOP, TSSOP8,.16
|
Pin Count |
8
|
|
Manufacturer Package Code |
613AC
|
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
2 Days
|
|
Samacsys Manufacturer |
onsemi
|
|
Family |
3G
|
|
JESD-30 Code |
R-PDSO-N8
|
R-PDSO-G8
|
JESD-609 Code |
e4
|
e0
|
Length |
1.95 mm
|
|
Load Capacitance (CL) |
50 pF
|
50 pF
|
Logic IC Type |
BUFFER
|
BUFFER
|
Max I(ol) |
0.004 A
|
0.004 A
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
3
|
|
Number of Inputs |
1
|
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VSON
|
TSSOP
|
Package Equivalence Code |
SOLCC6,.04,20
|
TSSOP8,.16
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, VERY THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Packing Method |
TR
|
TR
|
Peak Reflow Temperature (Cel) |
260
|
|
Prop. Delay@Nom-Sup |
14.5 ns
|
32 ns
|
Propagation Delay (tpd) |
14.5 ns
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Schmitt Trigger |
NO
|
NO
|
Seated Height-Max |
0.4 mm
|
|
Supply Voltage-Max (Vsup) |
5.5 V
|
|
Supply Voltage-Min (Vsup) |
1.65 V
|
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
AUTOMOTIVE
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.635 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
1 mm
|
|
Base Number Matches |
1
|
3
|
Rohs Code |
|
No
|
Output Characteristics |
|
OPEN-DRAIN
|
|
|
|
Compare NLU3G16AMX1TCG with alternatives