74HC373BQ
vs
MC74HC373ADTR2
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
ON SEMICONDUCTOR
Part Package Code
QFN
TSSOP
Package Description
HVQCCN, LCC20,.1X.18,20
TSSOP, TSSOP20,.25
Pin Count
20
20
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
HC/UH
JESD-30 Code
R-PQCC-N20
R-PDSO-G20
JESD-609 Code
e4
e4
Length
4.5 mm
6.5 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
BUS DRIVER
BUS DRIVER
Max I(ol)
0.006 A
0.006 A
Moisture Sensitivity Level
1
1
Number of Bits
8
8
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
20
20
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVQCCN
TSSOP
Package Equivalence Code
LCC20,.1X.18,20
TSSOP20,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method
TR
TR
Peak Reflow Temperature (Cel)
260
260
Prop. Delay@Nom-Sup
45 ns
38 ns
Propagation Delay (tpd)
265 ns
210 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1 mm
1.2 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
MILITARY
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
NICKEL PALLADIUM GOLD
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
0.5 mm
0.65 mm
Terminal Position
QUAD
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
2.5 mm
4.4 mm
Base Number Matches
4
2
Compare 74HC373BQ with alternatives
Compare MC74HC373ADTR2 with alternatives