MC74HC373ADTR2
vs
935165240112
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MOTOROLA SEMICONDUCTOR PRODUCTS
NXP SEMICONDUCTORS
Package Description
TSSOP, TSSOP20,.25
PLASTIC, TSSOP-20
Reach Compliance Code
unknown
unknown
JESD-30 Code
R-PDSO-G20
R-PDSO-G20
JESD-609 Code
e0
e4
Load Capacitance (CL)
50 pF
Logic IC Type
D LATCH
BUS DRIVER
Max I(ol)
0.0024 A
Number of Bits
8
1
Number of Functions
1
8
Number of Terminals
20
20
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Equivalence Code
TSSOP20,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method
TAPE AND REEL
Power Supplies
2/6 V
Prop. Delay@Nom-Sup
130 ns
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
AUTOMOTIVE
Terminal Finish
Tin/Lead (Sn/Pb)
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.635 mm
0.65 mm
Terminal Position
DUAL
DUAL
Base Number Matches
4
2
Part Package Code
TSSOP
Pin Count
20
HTS Code
8542.39.00.01
Family
HC/UH
Length
6.5 mm
Moisture Sensitivity Level
1
Number of Ports
2
Output Polarity
TRUE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Propagation Delay (tpd)
265 ns
Seated Height-Max
1.1 mm
Supply Voltage-Max (Vsup)
6 V
Supply Voltage-Min (Vsup)
2 V
Supply Voltage-Nom (Vsup)
5 V
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
4.4 mm
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