74HC368D,653 vs TC74HC368AFN feature comparison

74HC368D,653 NXP Semiconductors

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TC74HC368AFN Toshiba America Electronic Components

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Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS TOSHIBA CORP
Part Package Code SOP SOIC
Package Description PLASTIC, SO-16 SOP, SOP16,.25
Pin Count 16 16
Manufacturer Package Code SOT109-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01
Factory Lead Time 4 Weeks
Additional Feature ONE FUNCTION WITH TWO BITS ONE FUNCTION WITH TWO BITS
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G16 R-PDSO-G16
Load Capacitance (CL) 50 pF 150 pF
Logic IC Type BUS DRIVER BUS DRIVER
Moisture Sensitivity Level 1
Number of Bits 6 4
Number of Functions 1 2
Number of Ports 2 2
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 29 ns 165 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish NICKEL/PALLADIUM/GOLD (NI/PD/AU)
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Base Number Matches 2 1
Control Type ENABLE LOW
JESD-609 Code e0
Length 9.9 mm
Max I(ol) 0.006 A
Package Equivalence Code SOP16,.25
Prop. Delay@Nom-Sup 24 ns
Seated Height-Max 1.75 mm
Terminal Pitch 1.27 mm
Width 3.9 mm

Compare 74HC368D,653 with alternatives

Compare TC74HC368AFN with alternatives