74HC273BQ,115
vs
HD74HC377RP
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
RENESAS TECHNOLOGY CORP
Part Package Code
QFN
SOIC
Package Description
2.50 X 4.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT-764-1, DHVQFN-20
SOP,
Pin Count
20
20
Manufacturer Package Code
SOT764-1
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
HC/UH
JESD-30 Code
R-PQCC-N20
R-PDSO-G20
JESD-609 Code
e4
Length
4.5 mm
12.8 mm
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Moisture Sensitivity Level
1
Number of Bits
8
8
Number of Functions
1
1
Number of Terminals
20
20
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVQCCN
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Propagation Delay (tpd)
225 ns
175 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1 mm
2.65 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
4.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
NICKEL PALLADIUM GOLD
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
0.5 mm
1.27 mm
Terminal Position
QUAD
DUAL
Time@Peak Reflow Temperature-Max (s)
30
NOT SPECIFIED
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
2.5 mm
7.5 mm
fmax-Min
24 MHz
Base Number Matches
2
2
Pbfree Code
Additional Feature
WITH HOLD MODE
Compare 74HC273BQ,115 with alternatives
Compare HD74HC377RP with alternatives