74HC244BQ
vs
MM74HC244MTCX
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
FAIRCHILD SEMICONDUCTOR CORP
Part Package Code
QFN
TSSOP
Package Description
2.50 X 4.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT-764-1, DHVQFN-20
4.40 MM, MO-153, TSSOP-20
Pin Count
20
20
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Control Type
ENABLE LOW
ENABLE LOW
Family
HC/UH
HC/UH
JESD-30 Code
R-PQCC-N20
R-PDSO-G20
JESD-609 Code
e4
e4
Length
4.5 mm
6.5 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
BUS DRIVER
BUS DRIVER
Max I(ol)
0.006 A
0.006 A
Moisture Sensitivity Level
1
1
Number of Bits
4
4
Number of Functions
2
2
Number of Ports
2
2
Number of Terminals
20
20
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVQCCN
TSSOP
Package Equivalence Code
LCC20,.1X.18,20
TSSOP20,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
260
260
Prop. Delay@Nom-Sup
33 ns
29 ns
Propagation Delay (tpd)
165 ns
208 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1 mm
1.2 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
4.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
NICKEL PALLADIUM GOLD
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
0.5 mm
0.65 mm
Terminal Position
QUAD
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Width
2.5 mm
4.4 mm
Base Number Matches
3
3
Manufacturer Package Code
20LD, TSSOP, JEDEC MO-153, 4.4MM WIDE
ECCN Code
EAR99
Packing Method
TR
Compare 74HC244BQ with alternatives
Compare MM74HC244MTCX with alternatives