74HC138DB,118 vs HD74HC137RP-EL feature comparison

74HC138DB,118 NXP Semiconductors

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HD74HC137RP-EL Renesas Electronics Corporation

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Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS RENESAS ELECTRONICS CORP
Part Package Code SSOP1 SOIC
Package Description SSOP, SSOP16,.3 SOP,
Pin Count 16 16
Manufacturer Package Code SOT338-1
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01
Factory Lead Time 4 Weeks
Additional Feature 3 ENABLE INPUTS
Family HC/UH HC/UH
Input Conditioning STANDARD
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e4
Length 6.2 mm 9.9 mm
Load Capacitance (CL) 50 pF
Logic IC Type 3-LINE TO 8-LINE DECODER OTHER DECODER/DRIVER
Max I(ol) 0.004 A
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP SOP
Package Equivalence Code SSOP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE
Packing Method TR
Peak Reflow Temperature (Cel) 260 225
Prop. Delay@Nom-Sup 45 ns
Propagation Delay (tpd) 225 ns 300 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 5.3 mm 3.9 mm
Base Number Matches 2 2
Pbfree Code No

Compare 74HC138DB,118 with alternatives

Compare HD74HC137RP-EL with alternatives