HD74HC137RP-EL vs 74HC138DB feature comparison

HD74HC137RP-EL Hitachi Ltd

Buy Now Datasheet

74HC138DB NXP Semiconductors

Buy Now Datasheet
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer HITACHI LTD NXP SEMICONDUCTORS
Part Package Code SOIC SSOP
Package Description SOP, 5.30 MM, PLASTIC, MO-150, SOT338-1, SSOP-16
Pin Count 16 16
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G16 R-PDSO-G16
Length 9.9 mm 6.2 mm
Logic IC Type OTHER DECODER/DRIVER 3-LINE TO 8-LINE DECODER
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, SHRINK PITCH
Propagation Delay (tpd) 300 ns 225 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position DUAL DUAL
Width 3.9 mm 5.3 mm
Base Number Matches 2 3
Pbfree Code Yes
Rohs Code Yes
Additional Feature 3 ENABLE INPUTS
Input Conditioning STANDARD
JESD-609 Code e4
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Package Equivalence Code SSOP16,.3
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 45 ns
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s) 30

Compare HD74HC137RP-EL with alternatives

Compare 74HC138DB with alternatives