HD74HC137RP-EL vs HD74HC137FPEL feature comparison

HD74HC137RP-EL Hitachi Ltd

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HD74HC137FPEL Renesas Electronics Corporation

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer HITACHI LTD RENESAS ELECTRONICS CORP
Part Package Code SOIC SOIC
Package Description SOP, SOP, SOP16,.3
Pin Count 16 16
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G16 R-PDSO-G16
Length 9.9 mm 10.06 mm
Logic IC Type OTHER DECODER/DRIVER 3-LINE TO 8-LINE DECODER
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Propagation Delay (tpd) 300 ns 305 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 2.2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 4.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 3.9 mm 5.5 mm
Base Number Matches 2 1
Pbfree Code Yes
Rohs Code Yes
Input Conditioning LATCHED
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Package Equivalence Code SOP16,.3
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 60 ns
Time@Peak Reflow Temperature-Max (s) 20

Compare HD74HC137RP-EL with alternatives

Compare HD74HC137FPEL with alternatives