74F378SPCQR
vs
54F378/BFAJC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
FAIRCHILD SEMICONDUCTOR CORP
MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code
DIP
Package Description
SLIM, PLASTIC, DIP-16
DFP, FL16,.3
Pin Count
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
Additional Feature
WITH HOLD MODE
Family
F/FAST
JESD-30 Code
R-PDIP-T16
R-XDFP-F16
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Number of Bits
6
Number of Functions
1
6
Number of Terminals
16
16
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Output Polarity
TRUE
Package Body Material
PLASTIC/EPOXY
CERAMIC
Package Code
DIP
DFP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
FLATPACK
Propagation Delay (tpd)
9.5 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.25 V
Supply Voltage-Min (Vsup)
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
TTL
TTL
Temperature Grade
COMMERCIAL
MILITARY
Terminal Form
THROUGH-HOLE
FLAT
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
fmax-Min
100 MHz
Base Number Matches
1
3
Rohs Code
JESD-609 Code
e0
Max Frequency@Nom-Sup
80000000 Hz
Max I(ol)
0.02 A
Package Equivalence Code
FL16,.3
Power Supplies
5 V
Power Supply Current-Max (ICC)
45 mA
Screening Level
38535Q/M;38534H;883B
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Pitch
1.27 mm
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