74AUP2G132GT
vs
74HCT3G04GD
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NEXPERIA
|
| Part Package Code |
SON
|
|
| Package Description |
1 X 1.95 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT833-1, SON-8
|
VSON,
|
| Pin Count |
8
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
AUP/ULP/V
|
HCT
|
| JESD-30 Code |
R-PDSO-N8
|
R-PDSO-N8
|
| JESD-609 Code |
e3
|
e4
|
| Length |
1.95 mm
|
3 mm
|
| Load Capacitance (CL) |
30 pF
|
|
| Logic IC Type |
NAND GATE
|
INVERTER
|
| Max I(ol) |
0.0017 A
|
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
2
|
3
|
| Number of Inputs |
2
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VSON
|
VSON
|
| Package Equivalence Code |
SOLCC8,.04,20
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, VERY THIN PROFILE
|
SMALL OUTLINE, VERY THIN PROFILE
|
| Packing Method |
TR
|
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Prop. Delay@Nom-Sup |
27.9 ns
|
|
| Propagation Delay (tpd) |
27.9 ns
|
29 ns
|
| Qualification Status |
Not Qualified
|
|
| Schmitt Trigger |
YES
|
|
| Seated Height-Max |
0.5 mm
|
0.5 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
0.8 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
1.1 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
Tin (Sn)
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
1 mm
|
2 mm
|
| Base Number Matches |
2
|
2
|
| Date Of Intro |
|
2017-02-01
|
|
|
|
Compare 74AUP2G132GT with alternatives
Compare 74HCT3G04GD with alternatives