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74AUP2G132GT vs 74HCT3G34DC,125 feature comparison

74AUP2G132GT NXP Semiconductors

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74HCT3G34DC,125 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code SON SSOP
Package Description 1 X 1.95 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT833-1, SON-8 2.30 MM, PLASTIC, MO-187, SOT-765-1, VSSOP-8
Pin Count 8 8
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family AUP/ULP/V HCT
JESD-30 Code R-PDSO-N8 R-PDSO-G8
JESD-609 Code e3 e4
Length 1.95 mm 2.3 mm
Load Capacitance (CL) 30 pF 50 pF
Logic IC Type NAND GATE BUFFER
Max I(ol) 0.0017 A 0.004 A
Moisture Sensitivity Level 1 1
Number of Functions 2 3
Number of Inputs 2 1
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VSON VSSOP
Package Equivalence Code SOLCC8,.04,20 TSSOP8,.12,20
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
Packing Method TR TR
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 27.9 ns 29 ns
Propagation Delay (tpd) 27.9 ns 29 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES NO
Seated Height-Max 0.5 mm 1 mm
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 0.8 V 4.5 V
Supply Voltage-Nom (Vsup) 1.1 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Tin (Sn) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 1 mm 2 mm
Base Number Matches 2 2
Manufacturer Package Code SOT765-1
Logic » Gates
Logic » Gates

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