74HCT3G04GD
vs
74HCT3G14DP
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
NEXPERIA
|
PHILIPS SEMICONDUCTORS
|
Package Description |
VSON,
|
TSSOP, TSSOP8,.16
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Date Of Intro |
2017-02-01
|
|
Family |
HCT
|
|
JESD-30 Code |
R-PDSO-N8
|
R-PDSO-G8
|
JESD-609 Code |
e4
|
|
Length |
3 mm
|
|
Logic IC Type |
INVERTER
|
INVERTER
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
3
|
|
Number of Inputs |
1
|
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VSON
|
TSSOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, VERY THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Propagation Delay (tpd) |
29 ns
|
|
Seated Height-Max |
0.5 mm
|
|
Supply Voltage-Max (Vsup) |
5.5 V
|
|
Supply Voltage-Min (Vsup) |
4.5 V
|
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.635 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
2 mm
|
|
Base Number Matches |
2
|
3
|
Load Capacitance (CL) |
|
50 pF
|
Max I(ol) |
|
0.004 A
|
Package Equivalence Code |
|
TSSOP8,.16
|
Packing Method |
|
TR
|
Prop. Delay@Nom-Sup |
|
48 ns
|
Qualification Status |
|
Not Qualified
|
Schmitt Trigger |
|
YES
|
|
|
|
Compare 74HCT3G04GD with alternatives