74AUP1G16GM
vs
74AUP1G14GW,125
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
NEXPERIA
NXP SEMICONDUCTORS
Package Description
VSON,
1.25 MM, PLASTIC, MO-203, SC-88A, SOT353-1, TSSOP-5
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
AUP/ULP/V
AUP/ULP/V
JESD-30 Code
R-PDSO-N6
R-PDSO-G5
JESD-609 Code
e4
e3
Length
1.45 mm
2.05 mm
Load Capacitance (CL)
30 pF
30 pF
Logic IC Type
INVERTER
INVERTER
Max I(ol)
0.004 A
0.0017 A
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Number of Inputs
1
1
Number of Terminals
6
5
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VSON
TSSOP
Package Equivalence Code
SOLCC6,.04,20
TSSOP5/6,.08
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, VERY THIN PROFILE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
260
260
Power Supply Current-Max (ICC)
0.0014 mA
Propagation Delay (tpd)
20.8 ns
20 ns
Schmitt Trigger
YES
YES
Seated Height-Max
0.5 mm
1.1 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
0.8 V
0.8 V
Supply Voltage-Nom (Vsup)
1.1 V
1.1 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
NICKEL PALLADIUM GOLD
Tin (Sn)
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
0.5 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Width
1 mm
1.25 mm
Base Number Matches
2
2
Part Package Code
TSSOP
Pin Count
5
Manufacturer Package Code
SOT353-1
Factory Lead Time
4 Weeks
Packing Method
TR
Prop. Delay@Nom-Sup
20 ns
Qualification Status
Not Qualified
Compare 74AUP1G16GM with alternatives
Compare 74AUP1G14GW,125 with alternatives