74AHC273BQ,115
vs
TC74HC113F
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
NEXPERIA
TOSHIBA CORP
Part Package Code
QFN
SOIC
Package Description
DHVQFN-20
SOP,
Pin Count
20
14
Manufacturer Package Code
SOT764-1
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
8 Weeks
Family
AHC/VHC/H/U/V
HC/UH
JESD-30 Code
R-PQCC-N20
R-PDSO-G14
JESD-609 Code
e4
e0
Length
4.5 mm
Logic IC Type
D FLIP-FLOP
J-K FLIP-FLOP
Moisture Sensitivity Level
1
Number of Bits
8
2
Number of Functions
1
2
Number of Terminals
20
14
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
TRUE
COMPLEMENTARY
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVQCCN
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
SMALL OUTLINE
Packing Method
TR, 7 INCH
Peak Reflow Temperature (Cel)
260
Propagation Delay (tpd)
21.5 ns
170 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1 mm
1.8 mm
Supply Voltage-Max (Vsup)
5.5 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
NICKEL PALLADIUM GOLD
Tin/Lead (Sn/Pb)
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
0.5 mm
1.27 mm
Terminal Position
QUAD
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Trigger Type
POSITIVE EDGE
NEGATIVE EDGE
Width
2.5 mm
fmax-Min
100 MHz
68 MHz
Base Number Matches
2
1
Package Equivalence Code
SOP14,.3
Compare 74AHC273BQ,115 with alternatives
Compare TC74HC113F with alternatives