TC74HC113F
vs
GD54HC113J
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TOSHIBA CORP
LG SEMICON CO LTD
Part Package Code
SOIC
Package Description
SOP,
DIP, DIP14,.3
Pin Count
14
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
JESD-30 Code
R-PDSO-G14
R-XDIP-T14
JESD-609 Code
e0
e0
Logic IC Type
J-K FLIP-FLOP
J-K FLIP-FLOP
Number of Bits
2
Number of Functions
2
2
Number of Terminals
14
14
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Output Polarity
COMPLEMENTARY
Package Body Material
PLASTIC/EPOXY
CERAMIC
Package Code
SOP
DIP
Package Equivalence Code
SOP14,.3
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Propagation Delay (tpd)
170 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.8 mm
Supply Voltage-Max (Vsup)
6 V
Supply Voltage-Min (Vsup)
2 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Trigger Type
NEGATIVE EDGE
NEGATIVE EDGE
fmax-Min
68 MHz
Base Number Matches
1
2
Load Capacitance (CL)
50 pF
Max Frequency@Nom-Sup
20000000 Hz
Max I(ol)
0.004 A
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