74ABT541D,623 vs 54LS373/B2AJC feature comparison

74ABT541D,623 NXP Semiconductors

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54LS373/B2AJC Motorola Semiconductor Products

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA INC
Part Package Code SOP
Pin Count 20
Manufacturer Package Code SOT163-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature WITH DUAL OUTPUT ENABLE
Control Type ENABLE LOW
Family ABT LS
JESD-30 Code R-PDSO-G20 S-CQCC-N20
JESD-609 Code e4 e0
Length 12.8 mm 8.89 mm
Load Capacitance (CL) 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Max I(ol) 0.064 A
Moisture Sensitivity Level 1
Number of Bits 8 8
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 20 20
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code SOP QCCN
Package Equivalence Code SOP20,.4 LCC20,.35SQ
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE CHIP CARRIER
Packing Method TR
Peak Reflow Temperature (Cel) 260
Power Supply Current-Max (ICC) 30 mA
Prop. Delay@Nom-Sup 4.6 ns
Propagation Delay (tpd) 4.6 ns 39 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.65 mm 1.9 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology BICMOS TTL
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) TIN LEAD
Terminal Form GULL WING NO LEAD
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 7.5 mm 8.89 mm
Base Number Matches 1 1
Package Description QCCN, LCC20,.35SQ
Screening Level 38535Q/M;38534H;883B

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