72V3670L7-5PFG8
vs
IDT72V3670L7-5BBGI
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Package Description
LFQFP,
BGA, BGA144,12X12,40
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
5 ns
5 ns
Additional Feature
RETRANSMIT; AUTO POWER DOWN; ASYNCHRONOUS MODE IS ALSO POSSIBLE
Cycle Time
7.5 ns
7.5 ns
JESD-30 Code
R-PQFP-G128
S-PBGA-B144
Length
20 mm
13 mm
Memory Density
294912 bit
294912 bit
Memory Width
36
36
Number of Functions
1
1
Number of Terminals
128
144
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
8KX36
8KX36
Output Enable
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFQFP
BGA
Package Shape
RECTANGULAR
SQUARE
Package Style
FLATPACK, LOW PROFILE, FINE PITCH
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
260
Seated Height-Max
1.6 mm
1.97 mm
Supply Voltage-Max (Vsup)
3.45 V
3.45 V
Supply Voltage-Min (Vsup)
3.15 V
3.15 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
GULL WING
BALL
Terminal Pitch
0.5 mm
1 mm
Terminal Position
QUAD
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
40
Width
14 mm
13 mm
Base Number Matches
2
1
Pbfree Code
Part Package Code
BGA
Pin Count
144
Clock Frequency-Max (fCLK)
133.3 MHz
JESD-609 Code
e1
Memory IC Type
OTHER FIFO
Moisture Sensitivity Level
3
Package Equivalence Code
BGA144,12X12,40
Qualification Status
Not Qualified
Standby Current-Max
0.015 A
Supply Current-Max
0.04 mA
Terminal Finish
TIN SILVER COPPER
Compare 72V3670L7-5PFG8 with alternatives
Compare IDT72V3670L7-5BBGI with alternatives